Structure for ground and electronic apparatus including same

ABSTRACT

Disclosed is an electronic device of a slide type and including a main body, a guide rail coupled with the main body and configured to enable rotational movement, a driving device coupled with the main body and configured to control the rotational movement of the guide rail, a guide structure coupled with the main body, a slide body; and a connector structure coupled with the slide body, wherein the connector structure is coupled with the guide rail to linearly move according to the rotational movement, wherein the slide body is flexibly disposed in a designated area according to the linear movement of the connector structure, and wherein one surface of the connector structure and one surface of the guide structure are configured to form an electrical connection.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Bypass Continuation application of InternationalApplication No. PCT/KR2020/007253, which was filed on Jun. 4, 2020, andis based on and claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2019-0067959, which was filed in the KoreanIntellectual Property Office on Jun. 10, 2019, the entire disclosure ofeach of which is incorporated herein by reference.

BACKGROUND 1. Field

The disclosure relates generally to an electronic device, and moreparticularly, to a structure for a ground and an electronic deviceincluding the same.

2. Description of Related Art

An electronic device may include radio frequency (RF) circuitry fortransmitting a signal. The electronic device including the RF circuitrymay require a stable ground design to secure electronic-magneticinterference (EMI) performance and a return current path.

In the conventional art, a slide-type electronic device has limits instable ground designing due to two separate structures constituting theelectronic device.

As such, there is a need in the art for a slidable electronic devicethat has an improved ground design for more stable performance of theelectronic device, notwithstanding the two structures constituting theelectronic device.

SUMMARY

The disclosure has been made to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below.

Accordingly, an aspect of the disclosure is to provide an electronicdevice that may secure a stable ground area and increase EMI performanceby forming an electrical contact according to each slide operation,using structures configured for the slide operation.

Another aspect of the disclosure is to provide a structure for groundand an electronic device including the same, having an electricallyrobust design without requiring additional components, and whichprovides a sufficient return current path by securing a stable groundarea using slide operation structures.

According to an aspect of the disclosure, an electronic device of aslide type is provided. The electronic device includes a main body, aguide rail coupled with the main body and configured to enablerotational movement, a driving device coupled with the main body andconfigured to control the rotational movement of the guide rail, a guidestructure coupled with the main body, a slide body; and a connectorstructure coupled with the slide body, wherein the connector structureis coupled with the guide rail to linearly move according to therotational movement, wherein the slide body is flexibly disposed in adesignated area according to the linear movement of the connectorstructure, and wherein one surface of the connector structure and onesurface of the guide structure are configured to form an electricalconnection.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 illustrates an electronic device in a network environment,according to an embodiment;

FIG. 2A illustrates an internal structure of an electronic deviceaccording to an embodiment;

FIG. 2B illustrates a cross section of an internal structure of anelectronic device according to an embodiment;

FIG. 3 illustrates an electronic device for electrical connectionbetween slide structures according to an embodiment;

FIG. 4A and FIG. 4B illustrate graphs presenting capacitance forelectrical connection according to an embodiment;

FIG. 5 illustrates a guide structure according to an embodiment;

FIG. 6 illustrates a connector structure according to an embodiment;

FIG. 7 illustrates a connection between slide structures according to anembodiment;

FIG. 8 illustrates an electrical connection between slide structures fora first state, according to an embodiment;

FIG. 9 illustrates an electrical connection between slide structures fora second state, according to an embodiment;

FIG. 10 illustrates an electrical connection between slide structuresfor a third state, according to an embodiment;

FIG. 11A illustrates a connection between slide structures including acontact member according to a first embodiment;

FIG. 11B illustrates a connection between slide structures including acontact member according to a second embodiment;

FIG. 12 illustrates connection between slide structures based oncomputerized numerical control (CNC) processing according to anembodiment;

FIG. 13 illustrates a ground path based on connection between slidestructures including a flexible print circuit board (FPCB), according toan embodiment;

FIG. 14A illustrates connection between slide structures includingdirect current (DC) insulation, according to an embodiment;

FIG. 14B illustrates a return current path based on connection betweenslide structures including DC insulation, according to an embodiment;and

FIG. 15 illustrates a ground path based on connection between slidestructures including digital circuitry and analog circuitry, accordingto an embodiment.

DETAILED DESCRIPTION

Hereinafter, embodiments of this document will be described withreference to the accompanying drawings. In the disclosure, embodimentsare described in the drawings and a related detailed description is setforth, but this is not intended to limit the embodiments of thedisclosure. Descriptions of well-known functions and constructions areomitted for the sake of clarity and conciseness.

Terms in the disclosure are used for describing particular embodimentsand are not intended to limit the scope of other embodiments. A singularform may include a plurality of forms unless it is explicitlydifferently represented. All the terms used herein, including technicaland scientific terms, may have the same meanings as terms generallyunderstood by those skilled in the art to which the disclosure pertains.The terms defined in a typical dictionary among terms used in thedisclosure may be interpreted to have the same or similar meanings withthe context of the relevant art, and, unless explicitly defined in thisdisclosure, it shall not be interpreted ideally or excessively as formalmeanings. In some cases, even terms defined in this disclosure shouldnot be interpreted to exclude the embodiments of the disclosure.

Herein, a hardware approach is described as an example. However, sinceembodiments of the disclosure include a technology using both hardwareand software, the embodiments do not exclude a software-based approach.

With regard to descriptions of the drawings, similar reference numeralsmay be used for similar or related components.

In the disclosure, to determine whether a specific condition isfulfilled, expressions such as greater than or equal to or less than orequal to are used, but these are by way of example and do not excludeexpressions such as greater than or less than. As such, a conditionexpressed as greater than or equal to may be replaced by greater than, acondition expressed as less than or equal to may be replaced by lessthan, and a condition expressed as greater than or equal to and lessthan may be replaced by greater than and less than or equal to.

The disclosure relates to a structure for ground and an electronicdevice including the same in a wireless communication system.Specifically, the disclosure describes a technique for achieving EMIperformance and a return current path, by securing a stable ground areain a slide-type electronic device including a main body and a slidebody.

Terms herein referring to structures of the electronic device,connection between structures, RF circuitry, circuits for ground, andgeneral circuits such as a printed circuit board (PCB), a flexible PCB(FPCB), a signal line, and a data line, are illustrated for convenienceof explanation. Accordingly, the disclosure is not limited to terms tobe described, and other terms having an equivalent technical meaning maybe used.

FIG. 1 illustrates an electronic device 101 in a network environment 100according to an embodiment.

Referring to FIG. 1, the electronic device 101 in the networkenvironment 100 may communicate with an electronic device 102 via afirst network 198 (e.g., a short-range wireless communication network),or an electronic device 104 or a server 108 via a second network 199(e.g., a long-range wireless communication network). The electronicdevice 101 may communicate with the electronic device 104 via the server108. The electronic device 101 may include a processor 120, memory 130,an input device 150, a sound output device 155, a display device 160, anaudio module 170, a sensor module 176, an interface 177, a haptic module179, a camera module 180, a power management module 188, a battery 189,a communication module 190, a subscriber identification module (SIM)card 196, and an antenna module 197. At least one of the components maybe omitted from the electronic device 101, or one or more othercomponents may be added in the electronic device 101. Some of thecomponents may be implemented as single integrated circuitry. Forexample, the sensor module 176 may be implemented as embedded in thedisplay device 160.

The processor 120 may execute a program 140 to control at least oneother hardware or software component of the electronic device 101coupled with the processor 120 and may perform various data processingor computation. As at least part of the data processing or computation,the processor 120 may load a command or data received from anothercomponent in volatile memory 132, process the command or the data storedin the volatile memory 132, and store resulting data in non-volatilememory 134. The processor 120 may include a main processor 121 (e.g., acentral processing unit (CPU) or an application processor (AP)), and anauxiliary processor 123 (e.g., a graphics processing unit (GPU), animage signal processor (ISP), a sensor hub processor, or a communicationprocessor (CP)) that is operable independently from, or in conjunctionwith, the main processor 121. Additionally, or alternatively, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as partof the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component among the components of theelectronic device 101, instead of the main processor 121 while the mainprocessor 121 is in an inactive (e.g., sleep) state, or together withthe main processor 121 while the main processor 121 is in an activestate. The auxiliary processor 123 may be implemented as part of anothercomponent (e.g., the camera module 180 or the communication module 190)functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component ofthe electronic device 101. The various data may include the program 140and input data or output data for a command related thereto. The memory130 may include the volatile memory 132 or the non-volatile memory 134.

The program 140 may be stored in the memory 130 as software and mayinclude an operating system (OS) 142, middleware 144, or an application146.

The input device 150 may receive a command or data to be used by anothercomponent of the electronic device 101, from a user of the electronicdevice 101. The input device 150 may include a microphone, a mouse, akeyboard, or a digital pen (e.g., a stylus pen).

The sound output device 155 may output sound signals to the outside ofthe electronic device 101. The sound output device 155 may include aspeaker or a receiver. The speaker may be used for general purposes,such as playing multimedia or playing record, and the receiver may beused for an incoming call. The receiver may be implemented as separatefrom, or as part of the speaker.

The display device 160 may visually provide information to a user of theelectronic device 101. The display device 160 may include a display, ahologram device, or a projector and control circuitry to control acorresponding one of the display, hologram device, and projector. Thedisplay device 160 may include touch circuitry adapted to detect atouch, or sensor circuitry (e.g., a pressure sensor) adapted to measurethe intensity of force incurred by the touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. The audio module 170 may obtain the sound via the inputdevice 150 or output the sound via the sound output device 155 or aheadphone of an external electronic device 102 directly (e.g., wiredly)or wirelessly coupled with the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. The sensor module 176 may include a gesture sensor, agyro sensor, an atmospheric pressure sensor, a magnetic sensor, anacceleration sensor, a grip sensor, a proximity sensor, a color sensor,an infrared (IR) sensor, a biometric sensor, a temperature sensor, ahumidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice 102 directly (e.g., wiredly) or wirelessly. The interface 177 mayinclude a high-definition multimedia interface (HDMI), a universalserial bus (USB) interface, a secure digital (SD) card interface, or anaudio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device 102. The connecting terminal 178 may include an HDMIconnector, a USB connector, an SD card connector, or an audio connector(e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. The haptic module 179 may include a motor, a piezoelectricelement, or an electric stimulator.

The camera module 180 may capture a still image or moving images. Thecamera module 180 may include one or more lenses, image sensors, ISPs,or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. The power management module 188 may beimplemented as at least part of a power management integrated circuit(PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. The battery 189 may include a primary cell whichis not rechargeable, a secondary cell which is rechargeable, or a fuelcell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more CPs that are operableindependently from the AP 120 and supports a direct (e.g., wired)communication or a wireless communication. The communication module 190may include a wireless communication module 192 (e.g., a cellularcommunication module, a short-range wireless communication module, or aglobal navigation satellite system (GNSS) communication module) or awired communication module 194 (e.g., a local area network (LAN)communication module or a power line communication (PLC) module). Acorresponding one of these communication modules may communicate withthe external electronic device via the first network 198 (e.g., ashort-range communication network, such as Bluetooth™, wireless-fidelity(Wi-Fi) direct, or infrared data association (IrDA)) or the secondnetwork 199 (e.g., a long-range communication network, such as acellular network, the Internet, or a computer network (e.g., LAN or widearea network (WAN)). These various types of communication modules may beimplemented as a single component (e.g., a single chip), or may beimplemented as multi components (e.g., multi chips) separate from eachother. The wireless communication module 192 may identify andauthenticate the electronic device 101 in a communication network, suchas the first network 198 or the second network 199, using subscriberinformation (e.g., international mobile subscriber identity (IMSI))stored in the SIM card 196.

The antenna module 197 may transmit or receive a signal or power to orfrom the external electronic device of the electronic device 101. Theantenna module 197 may include an antenna including a radiating elementcomposed of a conductive material or a conductive pattern formed in oron a PCB. The antenna module 197 may include a plurality of antennas. Insuch a case, at least one antenna appropriate for a communication schemeused in the communication network, such as the first network 198 or thesecond network 199, may be selected by the communication module 190 fromthe plurality of antennas. The signal or the power may then betransmitted or received between the communication module 190 and theexternal electronic device via the selected at least one antenna. An RFintegrated circuit (RFIC) may be additionally formed as part of theantenna module 197.

At least some of the above-described components may be coupled mutuallyand communicate commands or data therebetween via an inter-peripheralcommunication scheme (e.g., a bus, general purpose input and output(GPIO), serial peripheral interface (SPI), or mobile industry processorinterface (MIPI)).

Commands or data may be transmitted or received between the electronicdevice 101 and the external electronic device 104 via the server 108coupled with the second network 199. Each of the electronic devices 102and 104 may be a device of a same type as, or a different type, from theelectronic device 101. All or some of operations to be executed at theelectronic device 101 may be executed at one or more of the externalelectronic devices 102, 104, or 108. For example, if the electronicdevice 101 should perform a function or a service automatically, or inresponse to a request from a user or another device, the electronicdevice 101, instead of, or in addition to, executing the function or theservice, may request the one or more external electronic devices toperform at least part of the function or the service. The one or moreexternal electronic devices receiving the request may perform the atleast part of the function or the service requested, or an additionalfunction or an additional service related to the request and transfer anoutcome of the performing to the electronic device 101. The electronicdevice 101 may provide the outcome, with or without further processingof the outcome, as at least part of a reply to the request. To that end,a cloud, distributed, or client-server computing technology may be used,for example.

The electronic device 101 may be a slide-type electronic deviceincluding a fixing unit and a moving unit which performs a slideoperation. Herein, the disclosure is described by referring to thefixing unit as a main body and the moving unit as a slide body forconvenience of descriptions, but embodiments of the disclosure may notbe limited thereto. The slide-type electronic device may be configuredto move the main body and to fix an auxiliary body or may be configuredto move both the two separate bodies, according to another embodiment.

EMI is electromagnetic interference referring to radiation disorder orradiation interference and indicates interference which hinders otherfunction due to electromagnetic waves emitted from the electronicdevice. The EMI may refer to an unwanted signal which worsens circuitryfunction and causes malfunction of equipment. The EMI may includeelectromagnetic noise generated by radiating electromagnetic waves intothe air (e.g., radiated emission (RE)) or electromagnetic noisetransmitted through a medium such as a signal line (e.g., conductedemission (CE)). A return current path is for ground connection of asignal. The ground may be connected stably as many return current pathsare secured, and accordingly, the EMI performance may be improved.

The slide body may include at least one of a camera module 180, RFcircuitry (e.g., the communication module 190), or an antenna module197. In this case, a PCB of the slide body may be required to connect instructure with a plurality of signal lines, and to transmit asignificant amount of data to a PCB of the main body. In so doing, tosecure the stable return current path for the signal delivery of theelectronic device 101 and to satisfy EMI performance, stable groundconnection (e.g., signal ground) may be required. For more stable groundconnection, ground structures of a great volume may be required, androbust electrical connection between structures interconnecting the mainbody and the slide body may be also required.

The disclosure relates to a structure for stably connecting electricalground each formed on a main body and a slide body, regardless of aslide operation, a shape and an arrangement of each structure, and anelectronic device including the same. Herein

FIG. 2A illustrates an internal structure of an electronic deviceaccording to an embodiment. The electronic device 101 may be aslide-type electronic device in which at least one of the separatedbodies has a flexible position on a designated path.

Referring to FIG. 2A, the internal structure 200 a of the electronicdevice may include a main body 210 having a housing. The housing forms afront surface (an xy plane, a (+)z direction), a rear surface (an xyplane, a (−)z direction), and a side surface surrounding at least partof a space between the front surface and the rear surface of theelectronic device 101. For example, the housing may include a metalhousing (or a metal front).

The main body 210 may include a main PCB 215 that includes elements(e.g., a resistor, a condenser, an integrated circuit (IC), etc.) forelectromagnetic operations of the electronic device 101. For example,the main PCB 215 may include at least one processor and a modem.

The electronic device 101 may include a slide body 260. The slide body260 may be disposed to at least in part overlap the main body 210, whenviewed from above a plane perpendicular to the z-axis (e.g., the xyplane). The slide body 260 may be disposed to have a flexible positionon a designated path based on a slide operation. The slide operation mayindicate a movement of the slide body 260 along a direction provided bythe main body 210, by coupling a structure of the slide body 260 and astructure of the main body 210 to allow movement (e.g., linear movement,curved movement) of the structure of the slide body 260 on an areaprovided by the structure of the main body 210. The slide body 260 maybe positioned in the housing of the main body 210 or disposed toprotrude outwards. If the slide body 260 is positioned inside thehousing of the main body 210, the slide body 260 may form the housing ofthe main body 210 when viewed from one side.

The slide body 260 may include a subsidiary PCB (sub-PCB) 265. Thesub-PCB may include elements (e.g., a resistor, a condenser, an IC,etc.) for the electromagnetic operations of the electronic device 101.The sub-PCB 265 may include an antenna module for communication. Thesub-PCB 265 may include an RF module and a camera module 180.

The electronic device 101 may include structures for performing theslide operation, in which the slide body 260 moves along a slide pathprovided by the main body 210. The structures for performing the slideoperation may include structures of the slide body 260 for the movementof the slide body 260 and structures of the main body 210 for providingthe movement or the slide path of the slide body 260, and the structuresare referred to herein as a slide structure.

The slide structure may include a guide structure 220. The guidestructure 220 guides the slide operation of the slide body 260 and maybe connected and secured to the housing of the main body 210. Adesignated path of the slide body 260 may be defined, based on a guidearea (or a guide path) provided by the guide structure 220.

The slide structure may include a connector structure 230 fortransmitting momentum for the slide operation to the slide body 260 andmay be physically connected with the slide body 260. The connectorstructure 230 may transmit the momentum of the slide structure disposedon the main body 210 to the slide body 260.

The slide structure may include a guide rail 240 disposed at least inpart inside the guide structure 220. The guide rail 240 may be coupledwith the connector structure 230, to provide movement of the guide rail240 to the connector structure 230. The connector structure 230 and theguide rail 240 may be coupled through a fixing body 242 for assistingthe coupling between the two structures. The fixing body 242 is insertedbetween a hole of the connector structure 230 and a shaft of the guiderail 240, to connect the connector structure 230 and the guide rail 240and to secure the connection. The guide rail 240 and the fixing body 242may correspond to a relationship between a bolt and a nut.

Due to the coupling between the connector structure 230 and the guiderail 240, the movement (e.g., rotational movement) of the guide rail 240may be transmitted to the connector structure 230 through the fixingbody 242. According to the rotation of the guide rail 240, the fixingbody 242 may move along the guide rail 240 with the connector structure230 on the guide area. For example, if the guide rail 240 rotatesclockwise, the connector structure 230 and the fixing body 242 coupledwith the guide rail 240 may move in the (−)y-axis direction. If theguide rail 240 rotates counterclockwise, the connector structure 230 andthe fixing body 242 coupled with the guide rail 240 may move in the(+)y-axis direction. That is, the connector structure 230 and the fixingbody 242 may be disposed together to allow the linear movement in they-axis direction in response to the rotational movement of the guiderail 240.

The guide structure 220 may be coupled with a driving device 245 whichcontrols the slide operation. The driving device 245 may be mechanicallycoupled to the main body 210. The driving device 245 may include anactuator which controls (e.g., rotates) the guide rail 240. The fixingbody 242 may have a flexible arrangement according to the linearmovement on the direction (i.e., the y-axis direction) of the guide rail240 under the control of the driving device 245. Herein, the movement ofthe slide body 260 in the (−)y-axis direction may be referred to as aslide-up operation, and the movement in the (+)y-axis direction may bereferred to as a slide-down operation.

Due to the slide operation of the slide body 260, a relative position ofthe sub-PCB 265 with respect to the main PCB 215 may be changed, andthis change may cause unstable ground connection between the sub-PCB 265and the main PCB 215. Hence, the slide-type electronic device 101 may berequired to secure a return current path and to satisfy EMI performance.The disclosure may provide stable ground connection for the sub-PCB 265and the main PCB 215, through a structure which establishes electricalconnection (e.g., DC contact or alternating current (AC) coupling)between the guide structure 220 and the connector structure 230. Thedisclosure does not exclude other configurations for electricallyconnecting the sub-PCB 265 and the main PCB 215. The electronic device101 may further include a flexible PCB (FPCB) 255 for connecting themain PCB 215 and the sub-PCB 265. The electronic device 101 may furtherinclude a contact structure (e.g., a C-clip) for connecting a contactportion of the main body 210 and the sub-PCB 265. The contact portion ofthe main body 210 may be electrically connected with the main PCB 215.

FIG. 2B illustrates a cross-section of an internal structure of theelectronic device according to an embodiment. The internal structure inFIG. 2B corresponds to the internal structure 200 a of FIG. 2A andaccordingly, descriptions on the same configuration may be omitted. Thecross section 200 b of FIG. 2B indicates a surface of the electronicdevice 101 in FIG. 2A taken along a plane perpendicular to the x-axis(e.g., the yz plane of FIG. 2A).

Referring to FIG. 2B, the slide body 260 of the electronic device 101may be flexibly disposed on the x-axis according to the slide operation.A first state 201 is when the slide body 260 protrudes from the mainbody 210 (e.g., a slide-up state), and a second state 202 is when theslide body 260 is received in the main body 210 (e.g., a slide-downstate). To transition from the first state 201 to the second state 202,the slide body 260 may be moved in the (+)y-axis direction. Totransition from the second state 202 to the first state 201, the slidebody 260 may be moved in the (−)y-axis direction.

The electronic device may electrically connect the guide structure 220and the connector structure 230 to electrically connect the main PCB 215and the sub-PCB 265. According to the movement of the slide body 260,the guide structure 220 and the connector structure 230 may be flexiblydisposed on the guide path. To maintain the electrical connectionbetween the main PCB 215 and the sub-PCB 265 notwithstanding theflexible arrangement, the electronic device 101 may include a groundconnector structure which maintains the electrical connection betweenthe guide structure 220 and the connector structure 230 in the firststate 201, the second state 202, and a third state which is in the slidemovement. The ground connector structure may include a DC contactstructure or an AC coupling structure.

FIG. 3 illustrates an electronic device for electrical connectionbetween slide structures according to an embodiment.

Referring to FIG. 3, the electronic device 300 may include a main body310 and a slide body 360.

The electronic device may include a dual slide structure for stableslide connection between the main body 310 and the slide body 360. Thedual slide structure may include two slide structures for the slideoperation. The electronic device may include, as the dual slidestructure, a first slide structure 315 a positioned at one end (e.g., a(−)x direction end of FIG. 3) of the electronic device and a secondslide structure 315 b positioned at the other end (e.g., an x-directionend of FIG. 3) of the electronic device 101. The slide structures 315 aand 315 b may include a structure connected to the main body 310 and astructure connected to the slide body 360 mechanically coupled for theslide operation.

The main body 310 may include a first guide structure 320 a and a secondguide structure 320 b for the stable slide connection. The first guidestructure 320 a and the second guide structure 320 b may be included anddisposed in a housing of the main body 310 and may be electricallyconnected to ground of a main PCB of the main body 310. The first slidestructure 315 a may include the first guide structure 320 a. The secondslide structure 315 b may include the second guide structure 320 b.

The slide body 360 may include a first connector structure 330 a and asecond connector structure 330 b for the stable slide connection. Thefirst slide structure 315 a may include the first connector structure330 a. The second slide structure 315 b may include the second connectorstructure 330 b. The slide body 360 may include a sub-PCB 375. Thesub-PCB 375 may include RF communication circuitry 376. The RFcommunication circuitry 376 may be connected to an antenna through thesub-PCB 375. The RF communication circuitry 376 may include an RFIC andmay be referred to as an RF-antenna (RF-A) module.

The electronic device may include the first slide structure 315 a andthe second slide structure 315 b, as the structure for the slideoperation of the slide body 360 on an area guided by the main body 310.Each slide structure may include electrical connection as well as themechanical connection for the slide operation. Herein, the connectionbetween the structures are described based on the first slide structure315 a, but the embodiments may be applied to the second slide structure315 b in the same or similar manner.

The first guide structure 320 a may be electrically connected to thefirst connector structure 330 a. The first guide structure 320 a may beconnected to the first connector structure 330 a in the DC contactmanner. Alternatively, the first guide structure 320 a may be connectedto the first connector structure 330 a in the AC coupling manner. Arecessed space may be formed in the first guide structure 320 acorresponding to the y-axis direction such that the first connectorstructure 330 a has a flexible arrangement in the y-axis direction. Thespace may be referred to as a guide area. The first guide structure 320a may include a plurality of surfaces forming the guide area. The firstguide structure 320 a may include a first guide rail 340 a in the guidearea. The first guide rail 340 a may be coupled with a first drivingdevice 345 a through the first driving device 345 a and a first shaft343 a.

Under the control of the first driving device 345 a, the first guiderail 340 a may provide the slide operation to the first connectorstructure 330 a. Specifically, the first driving device 345 a maycontrol the first guide rail 340 a to rotate. According to therotational movement of the first guide rail 340 a, a fixing body 342 aconnected to the first guide rail 340 a may perform linear movement inthe y-axis direction. According to the movement of the fixing body 342a, the first connector structure 330 a connected to the structure mayalso perform linear movement in the same direction.

The first connector structure 330 a may be electrically connected to thefirst guide structure 320 a to connect the sub-PCB 375 of the slide body360 to a main PCB of the main body 310 and to secure a ground path ofthe sub-PCB 375. For electrical connection, the first connectorstructure 330 a may include a conductive member. The first connectorstructure 330 a may be connected in the DC manner due to the physicalcontact with the first guide structure 320 a. The first connectorstructure 330 a may be disposed such that one surface forming the guidearea of the first guide structure 320 a and one surface of the firstconnector structure 330 a form capacitance. Through the closely arrangedstructure, the first connector structure 330 a and the first guidestructure 320 a may be electrically connected.

As described above, the electronic device 101 may have the dual slidestructure. Hence, the functions, the operations, and the arrangements ofthe first slide structure 315 a, the first guide structure 320 a, thefirst connector structure 330 a, the first guide rail 340 a, the firstfixing body 342 a, the first shaft 343 a, and the first driving device345 a may be applied to the second slide structure 315 b, the secondguide structure 320 b, the second connector structure 330 b, the secondguide rail 340 b, the second fixing body 342 b, the second shaft 343 b,and the second driving device 345 b identically or as modified by oneskilled in the art. The electronic device may have a structure in whichthe electrical connection between the two slide structures is formed ina different manner. The electronic device 101 in the slide-up state mayinclude slide structures disposed to DC-contact the first connectorstructure 330 a with the first guide structure 320 a, and to AC-couplethe second connector structure 330 b with second guide structure 320 b.

Herein, the connector structure and the guide structure may beelectrically connected through at least one of a direct connectorstructure (a contact structure) or a coupling structure. The contactstructure is a connection for transmitting a signal between twoconductors, by directly contacting the two conductors, and may providethe DC-type electrical connection. The coupling structure may provide anelectrical connection for delivering AC signal energy electrically ormagnetically between separate spaces or lines, by forming capacitance topass an AC component of the signal. The capacitance may affectperformance of the AC coupling.

FIG. 4A and FIG. 4B illustrate graphs presenting capacitance forelectrical connection according to various embodiments. Graph 400 a inFIG. 4A and graph 400 b in FIG. 4B illustrate a capacitance valuerelated to AC coupling connection between a guide structure 220 and aconnector structure 230 which are the slide structures.

Referring to FIG. 4A, graph 400 a shows a relationship between thefrequency and scattering (S)-parameters. The S-parameter may indicate aratio of an input voltage to an output voltage in the frequency domain.A horizontal axis 410 a represents the frequency in gigahertz (GHz), anda vertical axis 420 a represents the S-parameter in decibels (dB). Ifcomparing performance values based on each capacitor at the samefrequency of graph 400 a, it may be required to have the capacitancevalue greater than or equal to a reference value, to achieve theperformance over a specific level. For example, coupling circuitryformed due to the coupling between the slide structures may be requiredto provide the capacitance over 5 picofarads (pF) at 1.8 GHz. The higherthe capacitance, the higher the coupling performance of the couplingcircuitry becomes.

Referring to FIG. 4B, graph 400 b shows the relationship between thefrequency and the S-parameters. Graph 400 b shows the couplingperformance in the frequency domain higher than that of graph 400 a. Ahorizontal axis 410 b represents the frequency (GHz), and a verticalaxis 420 b represents the S-parameters (dB). If comparing performancevalues according to each capacitor even in the high frequency range(e.g., 6 GHz or higher), it may be required to have the capacitancevalue greater than or equal to the reference value, to achieve theperformance over a specific level. For example, the coupling circuitrymay be required to provide the capacitance over about 1 pF at 10 GHz.

The AC coupling of the electronic device indicates a scheme ofelectrically connecting two structures by forming capacitance through asurface of the connector structure and a surface of the guide structure.Each surface may include a conductor to form the capacitance. Onesurface of the structure may include the conductor on a surface facingone surface of the other structure. It may be difficult to achievesufficient capacitance capacity required for the AC coupling merely withthe surfaces of the structure and an air gap. To increase thecapacitance capacity, the electronic device 101 may include a structurewhich disposes a dielectric (an insulator) between one surface of theguide structure (i.e., a first conductor) and one surface of theconnector structure (i.e., a second conductor).

The electronic device 101 may include an insulation layer disposedbetween the surface of the first conductor and the surface of the secondconductor. By disposing the insulation layer, the capacitance may beformed in a structure of conductor-insulator-conductor. A shape of thedielectric included in the insulation layer may include at least one ofpowder, fiber, rod, flake, film, sheet, colloid, and sol. The insulationlayer may include a polyimide (PI) film.

The electronic device 101 may include a guide structure in which atleast one surface of the first conductor is non-conductively coated, ora connector structure in which at least one surface of the secondconductor is non-conductively coated. The nonconductive coating mayinclude anodizing coating. Due to the anodizing coating, a dielectricfilm may be formed between the surfaces of the two conductors. In theslide structure, the capacitance may be formed in a stacked structureconstituted by the first conductor, a nonconductive coating (e.g.,anodizing), an air gap, a nonconductive coating (e.g., anodizing), and aconductor (e.g., the second conductor). The stacked structure may be astructure in which an air gap is formed between the anodized-coatedfirst conductor and the anodized-coated second conductor. By including aseparate dielectric in the slide structure, an additional dielectric maybe replaced instead of the air gap of the structure.

As described above, the gap between the slide structures (i.e., thesurface of the guide structure and the surface of the slide structure)may be reduced through the insulation layer or the nonconductive coatingprocessing, thereby increasing the capacitance.

Table 1 below shows capacitance according to each of the insulationlayer including the PI film, the anodizing coating, and the air gaptype.

TABLE 1 i. X (in Gap (in millimeters) Y Area micrometers) capacitance(mm) (mm) (mm²) (μm) permittivity (Pf) insulation 3 3 9 20 3.5 13.9layer (PI film) anodizing 3 3 9 9 3.7 32.8 coating air gap 5 10 50 100 14.4

Referring to Table 1, it may be identified that even if the areareduces, the connector structure providing high capacitance is formeddue to the decrease of the gap and the high permittivity. The decreasesof the area and the gap may secure a margin space of the electronicdevice 101, thereby enabling circuitry design for an additionalfunction.

A state of an electronic device 101 according to a slide operation ofthe disclosure may be defined as three states including a first state, asecond state, and a third state. The first state 201 indicates when theslide body 260 overlaps the main body 210 in the least area, when viewedfrom above one surface of the electronic device (e.g., the xy plane),and may be referred to as a slide-up state. The second state 202indicates when the slide body 260 overlaps the greatest area from themain body 210, when viewed from above one surface of the electronicdevice and may be referred to as a slide-down state. The third state isan intermediate state of the slide operation moving from the first stateto the second state or from the second state to the first state and maybe referred to as a slide-move state.

The electronic device suggests an arrangement, a shape, and an operatingmechanism of each slide structure to support stable electricalconnection between two structures regardless of the slide operation.

FIG. 5 illustrates a guide structure according to an embodiment. Theguide structure 520 is for guiding the slide operation of the slide bodyand may be disposed to connect a main body 210, 310 or a main PCB 215.The guide structure 520 relates to the guide structure 220, the firstguide structure 320 a, or the second guide structure 320 b.

Referring to the illustration 500 in FIG. 5, the guide structure 520 mayinclude a guide unit in the form including the plurality of thesurfaces. A guide area may be formed through the plurality of thesurfaces of the guide unit for guiding the slide operation of the slidebody 260 of the electronic device 101. The guide area indicates an areafor flexibly disposing a part of a fixing body 242 connected to aconnector structure 230. Each surface of the guide structure 520 may bereferred to as a guide surface.

The plurality of the surfaces of the guide structure 520 may include afirst surface 501, a second surface 502, and a third surface 503. Thefirst surface 501 forms electrical connection with the connectorstructure in the first state (i.e., the slide-up state) of theelectronic device 101. The second surface 502 forms electricalconnection with the connector structure in the second state (i.e., theslide-down state) of the electronic device 101. The third surface 503forms electrical connection with the connector structure in the thirdstate (i.e., the slide-move state) of the electronic device 101.

The plurality of the surfaces of the guide structure 520 may correspondto faces of a hexahedron. Referring to the xyz coordinate system shownin FIG. 5, the first surface 501 may be a surface parallel to the xzplane. The second surface 502 may be a surface parallel to the xz plane.The shape of the guide structure 520 may refer to when the first surface501 and the second surface 502 face each other at the end of the guidearea. The third surface 503 may be a surface parallel to the yz plane.

The guide structure 520 may be electrically connected to the connectorstructure according to the slide direction. The guide structure 520 maybe disposed to have a surface contacting the surface of the connectorstructure in the DC manner or may be disposed to have a surface formingthe capacitance with the surface of the connector structure in the ACmanner.

FIG. 6 illustrates a connector structure 630 according to an embodiment.The connector structure 630 may be coupled to a slide body to transmitmomentum transmitted from a structure of a main body to the slide body.In this manner, the slide body may slide and linearly move. Theconnector structure 630 relates to the connector structure 230, thefirst connector structure 330 a, or the second connector structure 330b.

Referring to the illustration 600 in FIG. 6, the connector structure 630may include a bonding unit in a form including the plurality of thesurfaces. The bonding unit may provide electrical connection between themain body 210 and the slide body 260, for the slide operation. Throughthe structure physically fastened to a guide structure 220 of the mainbody and a guide rail 240, the bonding unit may transfer energygenerated by the movement generated in the slide body to the main bodyor transfer kinetic energy according to the rotational movement of theguide rail 240 generated in the main body to the slide body.

The bonding unit may be bonding surfaces of the connector structure 630.The bonding unit may be disposed in connection with a fixing body 242 tolinearly move the connector structure 630 according to the linearmovement of the fixing body. The bonding unit may include a hole 604 oneach of two symmetrical surfaces through which the guide rail 240passes. Each surface of the connector structure 630 may be referred toas a bonding surface.

The plurality of the surfaces of the bonding unit may include a firstsurface 601, a second surface 602, and a third surface 603. The firstsurface 601 forms electrical connection with the guide structure in thefirst state (i.e., the slide-up state) of the electronic device 101. Thesecond surface 602 forms electrical connection with the guide structurein the second state (i.e., the slide-down state) of the electronicdevice. The third surface 603 forms electrical connection with the guidestructure in the third state (i.e., the slide-move state) of theelectronic device 101.

The plurality of the surfaces of the bonding unit may correspond tofaces on a hexahedron. Referring to the xyz coordinate system shown inFIG. 6, the first surface 601 may be a surface parallel to the yz plane.The second surface 602 may be a surface parallel to the yz plane. Theconnector structure 630 may have a shape in which the first surface 601and the second surface 602 face each other. The third surface 603 may bea surface parallel to the xz plane.

The connector structure 630 may be electrically connected to the guidestructure according to the slide direction. The connector structure 630may be disposed to have a surface contacting the surface of the guidestructure in the DC manner or may be disposed to have a surface formingcapacitance with the surface of the guide structure in the AC manner.

FIG. 7 illustrates a connection between slide structures according to anembodiment. The slide structures may include the guide structure 520 ofFIG. 5 and the connector structure 630 of FIG. 6. The slide structuresmay include a fixing body 742 for interconnecting the two structures, aguide rail 740 for sliding operation of the two connected structures,and a driving device 745.

Referring to the illustration 700 in FIG. 7, the guide structure 520 mayinclude the guide area formed with the first surface 501 for theslide-up state, the second surface 502 for the slide-down state, and thethird surface 503 for the slide-move state. The connector structure 630includes the bonding unit formed with the first surface 601 for theslide-up state, the second surface 602 for the slide-down state, and thethird surface 603 for the slide-move state.

In the slide-up state, the electronic device 101 may include a slideassembly disposed to electrically connect the first surface 501 of theguide structure 520 and the first surface 601 of the connector structure630. The first surface 501 of the guide structure 520 and the firstsurface 601 of the connector structure 630 may physically contact to beconnected in the DC manner. Alternatively, the first surface 501 of theguide structure 520 and the first surface 601 of the connector structure630 may be disposed apart within a specific distance range to beelectrically connected in the AC manner. A dielectric (or an insulator)may be disposed within the specific distance range. A dielectric layerprocessed with the nonconductive coating may be disposed on at least oneof the surfaces.

In the slide-down state, the electronic device may include the slideassembly in which the second surface 502 of the guide structure 520 andthe second surface 602 of the connector structure 630 are electricallyconnected. The second surface 501 of the guide structure 520 and thesecond surface 602 of the connector structure 630 may physically contactto be connected in the DC manner. The second surface 502 of the guidestructure 520 and the second surface 602 of the connector structure 630may be disposed apart within a specific distance range to beelectrically connected in the AC manner. A dielectric (or an insulator)may be disposed within the specific distance range. A dielectric layerprocessed with the nonconductive coating may be disposed on at least oneof the surfaces.

In the slide-move state, the electronic device may include the slideassembly in which the third surface 503 of the guide structure 520 andthe third surface 603 of the connector structure 630 are electricallyconnected. The third surface 503 of the guide structure 520 and thethird surface 603 of the connector structure 630 may be disposed apartwithin a specific distance range to be connected in the AC manner. Adielectric (or an insulator) may be disposed within the specificdistance range. A dielectric layer processed with the nonconductivecoating may be disposed on at least one of the surfaces.

An electronic device herein may include a guide structure and aconnector structure disposed to form capacitance through a conductiveplate of two surfaces each and a dielectric (e.g., air) disposed betweenthe two surfaces for the AC-type electrical connection between a mainbody and a slide body.

FIG. 8 illustrates an electrical connection between slide structures fora first state, according to an embodiment. In the illustration 800 inFIG. 8, the first state may be the slide-up state in which the slidebody may overlap the main body in the least amount of area. The slidebody may protrude from the housing of the main body. The slidestructures may include a guide structure 820 physically connected to themain body and a connector structure 830 physically connected to theslide body.

Referring to a first perspective view 800 a, the connector structure 830may include a bonding unit including a first surface 801 a. Theconnector structure 830 may have a shape including the first surface 801a to electrical connect with a first surface 801 b of the guidestructure 820 in the first state. Referring to a second perspective view800 b, the guide structure 820 may include a guide area including thefirst surface 801 b. The guide structure 820 may have a shape includingthe first surface 801 b to electrically connect with the first surface801 a of the connector structure 830 in the first state. The firstsurface 801 a of the connector structure 830 and the first surface 801 bof the guide structure 820 may be perpendicular to the slide movementdirection.

Referring to a front view 800 c, electrical connection 890 may be formedthrough the first surface 801 a of the connector structure 830 and thefirst surface 801 b of the guide structure 820. A conductor of the firstsurface 801 a of the connector structure 830 and a conductor of thefirst surface 801 b of the guide structure 820 face each other and maybe disposed to form capacitance. The capacitance may be determined basedon Equation (1), as follows.

$\begin{matrix}{C = {ɛ\frac{A}{d}}} & (1)\end{matrix}$

In Equation (1), C denotes the capacitance, e denotes the permittivitybetween the two conductors, A denotes an area of the conductor, and ddenotes a distance between the two conductors. The area of the conductormay indicate an overlapping area between the two conductors in onedirection.

In Equation (1), ε, A, and d are determined depending on physicalparameters between the conductor of the first surface 801 a of theconnector structure 830 and the conductor of the first surface 801 b ofthe guide structure 820, and gap design for efficient arrangement of thetwo structures may be considered.

The electronic device 101 may include an arrangement structure in whichthe conductor of the first surface 801 a of the connector structure 830and the conductor of the first surface 801 b of the guide structure 820are spaced apart in a specific range to form the capacitor. The guidestructure 820 and the connector structure 830 may be disposed accordingto a separation distance determined based on the permittivity. Thepermittivity may affect the capacitance. A dielectric may be disposedbetween the conductor of the first surface 801 a of the connectorstructure 830 and the first surface 801 b of the guide structure 820.Since the permittivity between the two structures is determined based onthe disposed dielectric, the guide structure 820 and the connectorstructure 830 may be disposed according to the separation distancedetermined based on the dielectric. The dielectric may be configured invarious fashions, such as by an insulation layer, a film formed by theanodizing coating processing, or air with the permittivity of 1.

The guide structure 820 and the connector structure 830 may be disposedaccording to the separation distance determined based on the area ofeach conductor, since the area of the conductor for providing the samecapacitance is inversely proportional to the separation distance. As theoverlapping area between the two conductors which form the capacitorincreases, a narrower separation distance may be obtained. As theseparation distance decreases, a length of the slide assemblycorresponding to the slide movement direction for the slide operationmay decrease. Conversely, as the overlapping area between the twoconductors decreases, a longer separation distance may be obtained. Theelectronic device 101 may include the guide structure 820 and theconnector structure 830 disposed in consideration of the trade-offbetween the separation distance and the conductor area.

The guide structure 820 and the connector structure 830 may be disposedaccording to the separation distance determined based on an operatingfrequency, since the range of the capacitance required for sufficientcoupling performance is determined based on the operating frequency ofthe RF signal, as described in FIG. 4A and FIG. 4B.

As the capacitance is formed, the connector structure 830 and the guidestructure 820 may be coupled in the AC manner. The arrangement of theconnector structure 830 and the guide structure 820 may includeequivalent circuitry including a capacitor connected in series.

In an alternative to FIG. 8, the conductor of the first surface 801 a ofthe connector structure 830 and the conductor of the first surface 801 bof the guide structure 820 may be disposed to directly contact eachother. Accordingly, the connector structure 830 and the guide structure820 may be connected in the DC manner.

FIG. 9 illustrates an electrical connection between slide structures fora second state, according to an embodiment. In the illustration 900 inFIG. 9, the second state may be the slide-down state in which the slidebody may overlap the main body in a greatest amount of area and may bereceived in the main body. The slide structures may include a guidestructure 920 physically connected to the housing of the main body and aconnector structure 930 physically connected to the slide body.

Referring to a first perspective view 900 a, the connector structure 930may include a bonding unit including a second surface 902 a. Theconnector structure 930 may have a shape including the second surface902 a for electrically connecting with a second surface 902 b of theguide structure 920 in the second state. Referring to a secondperspective view 900 b, the guide structure 920 may include a guide areaincluding the second surface 902 b. The guide structure 920 may have ashape including the second surface 902 b for electrically connectingwith the second surface 902 a of the connector structure 930 in thesecond state. The second surface 902 a of the connector structure 930and the second surface 902 b of the guide structure 920 may beperpendicular to the slide movement direction.

Referring to a front view 900 c, electrical connection 990 may be formedthrough the second surface 902 a of the connector structure 930 and thesecond surface 902 b of the guide structure 920. A conductor of thesecond surface 902 a of the connector structure 930 and a conductor ofthe second surface 902 b of the guide structure 920 face each other andmay be disposed to form capacitance. The capacitance of the capacitormay be determined based on Equation (1). The descriptions on the firstsurfaces 801 a and 801 b of the structures of FIG. 8 may be applied tothe descriptions of the second surfaces 902 a and 902 b of thestructures of FIG. 9 in the same or similar manner.

In Equation (1), ε, A, and d are determined depending on physicalparameters between the conductor of the second surface 902 a of theconnector structure 930 and the conductor of the second surface 902 b ofthe guide structure 920, and gap design for efficient arrangement of thetwo structures may be considered.

The electronic device 101 may include an arrangement structure in whichthe conductor of the second surface 902 a of the connector structure 930and the conductor of the second surface 902 b of the guide structure 920are spaced apart within a specific range to form the capacitance. Theseparation distance may be determined based on at least one of adielectric disposed between the two conductors, an area of eachconductor, an overlapping area to form the capacitor, and an operatingfrequency of a transmitted signal. As the capacitance is formed, theconnector structure 930 and the guide structure 920 may be coupled inthe AC manner.

In an alternative to FIG. 9, the conductor of the second surface 902 aof the connector structure 930 and the conductor of the second surface902 b of the guide structure 920 may be disposed to directly contacteach other. Accordingly, the connector structure 930 and the guidestructure 920 may be connected in the DC manner.

FIG. 10 illustrates an electrical connection between slide structuresfor a third state, according to an embodiment. In the illustration 1000in FIG. 10, the third state may be the slide-move directed to theintermediate state between the slide-down state of FIG. 8 and theslide-up state of FIG. 9. The slide body may overlap the main body in aspecific range. The slide body may be included in the housing of themain body. The slide structures may include a guide structure 1020physically connected to the main body and a connector structure 1030physically connected to the slide body.

Referring to a first perspective view 1000 a, the connector structure1030 may include a bonding unit including a third surface 1003 a. Theconnector structure 1030 may have a shape including the third surface1003 a to electrically connect with a third surface 1003 b of the guidestructure 1020 in the first state. Referring to a second perspectiveview 1000 b, the guide structure 1020 may include a guide area includingthe third surface 1003 b. The guide structure 1020 may have a shapeincluding the third surface 1003 b to electrically connect with thethird surface 1003 a of the connector structure 1030 in the first state.The third surface 1003 a of the connector structure 1030 and the thirdsurface 1003 b of the guide structure 1020 may be parallel to the slidemovement direction.

Referring to a front view 1000 c, electrical connection 1090 may beformed through the third surface 1003 a of the connector structure 1030and the third surface 1003 b of the guide structure 1020. A conductor ofthe third surface 1003 a of the connector structure 1030 and a conductorof the third surface 1003 b of the guide structure 1020 face each otherand may be disposed to build a capacitor. Capacitance of the capacitormay be determined based on Equation (1). The descriptions on the firstsurfaces 801 a and 801 b of the structures of FIG. 8 may be applied tothe descriptions of the third surfaces 1003 a and 1003 b of thestructures of FIG. 10 in the same or similar manner.

In Equation (1), ε, A, and d are determined depending on physicalparameters between the conductor of the third surface 1003 a of theconnector structure 1030 and the conductor of the third surface 1003 bof the guide structure 1020, and gap design for efficient arrangement ofthe two structures may be considered.

In the electronic device 101, the conductor of the third surface 1003 aof the connector structure 1030 and the conductor of the third surface1003 b of the guide structure 1020 are spaced apart within a specificrange to form the capacitance. The separation distance may be determinedbased on at least one of a dielectric disposed between the twoconductors, an area of each conductor, an overlapping area to form thecapacitance, and an operating frequency of a transmitted signal. As thecapacitance is formed, the connector structure 1030 and the guidestructure 1020 may be coupled in the AC manner. The formed capacitancemay be expressed as equivalent circuitry including a capacitor connectedwith the connector structure 1030 and the guide structure 1020 inseries.

The AC-type electrical connection and the shape and the arrangementbetween the conductors for adequate capacitance have been described inFIG. 8 and FIG. 10.

FIG. 11A illustrates a connection between slide structures including acontact member according to a first embodiment. In the illustration 1100a in FIG. 11A, a first surface 1101 of a guide structure 1120 acorresponding to the slide-up state and a first surface 1111 of aconnector structure 1130 a are physically contacted through a contactmember 1170 is described. The contact member 1170 of FIG. 11A mayinclude a conductor for providing stable DC connection during themovement.

Referring to FIG. 11A, the contact member 1170 may be attached to thefirst surface 1111 of the connector structure 1130 a. The first surface1111 of the connector structure 1130 a may include the contact member1170 which is disposed on the first surface 1111. The contact member1170 may be disposed to protrude by a specific height on the firstsurface 1111. The contact member 1170 may include a contact boss. Thecontact member 1170 may be disposed on each of four edges of the firstsurface 1111.

The contact member 1170 may include a conductor. The contact member 1170may be connected to the first surface 1101 of the guide structure 1120 ain the DC manner. By moving the first surface 1111 of the connectorstructure 1130 a to the first surface 1101 of the guide structure 1120 athrough a guide rail 1140 a and a driving device 1145 a, the contactmember 1170 may contact the first surface 1101 of the guide structure1120 a. An accurate contact is formed between the two surfaces throughthe contact member 1170, thus supplementing electrical connection whichmay vary according to a gap or an external pressure caused by the slidemovement.

It has been described that the contact member 1170 is disposed on thesurface of the connector structure 1130 a in FIG. 11A, but it is notedthat the contact member 1170 may be disposed on the surface of the guidestructure 1120 a.

FIG. 11B illustrates the connection between the slide structuresincluding the contact member according to a second embodiment. In theillustration 1100 b in FIG. 11B, a situation in which a second surface1102 of a guide structure 1120 b corresponding to the slide-down stateand a second surface 1112 of a connector structure 1130 b are physicallycontacted through a contact member 1180 is described. The contact member1180 of FIG. 11B may include a conductor for providing the DC connectionwhich is robust to corrosion.

Referring to FIG. 11B, the contact member 1180 may be attached to thesecond surface 1102 of the guide structure 1120 b. The second surface1102 of the guide structure 1120 b may include the contact member 1180.The contact member 1180 may be disposed to protrude by a specific heighton the second surface 1102. The contact member 1180 may include apolygonal or a circular conductor.

The contact member 1180 may include a conductive tape. The conductivetape may include a gasket tape. The gasket tape may be disposed tosupplement a part which is subject to unevenness due to corrosion.Hence, to prevent abrasion or corrosion due to the DC contact, theelectronic device 101 may include the gasket tape disposed on onesurface of the guide structure 1120 b. Through the gasket tape, it ispossible to supplement the electrical connection which may varyaccording to the corrosion or the abrasion of the contact portion due tothe repeated slide movements.

The contact member 1180 may be connected to the second surface 1112 ofthe connector structure 1130 b in the DC manner. The second surface 1112of the connector structure 1130 b moves to the second surface 1102 ofthe guide structure 1120 b through the guide rail 1140 b and the drivingdevice 1145 b, and accordingly, the contact member 1180 may contact thesecond surface 1112 of the connector structure 1130 b.

In FIG. 11B, the contact member 1180 is disposed on the surface of theguide structure 1120 b, but the contact member 1180 may alternatively bedisposed on the surface of the connector structure 1130 b.

FIG. 12 illustrates a connection between slide structures based on CNCprocessing according to an embodiment.

Referring to the illustration 1200 in FIG. 12, the first guide structure1220 a may be CNC-processed and disposed 1211 a on a housing of a mainbody 1210. The second guide structure 1220 b may be CNC-processed anddisposed 1211 b on the housing of the main body 1210. The CNC processingindicates a scheme of constructing a material with a computerizednumerical control processing machine.

Characteristics of the electrical connection formed with the connectorstructure may differ depending on the arrangement of the guidestructures 1220 a and 1220 b. For example, if a gap occurs due to adesign error of the guide structure and the conductor area forming thecapacitor reduce by 1 mm, the AC connection may significantly affect thecapacitance value. The gap design error may be reduced, by forming aslide assembly which is disposed more precisely on the main body 1210through the CNC processing.

An electronic device including electronic circuitry may require a grounddesign for securing EMI performance and a return current path. Inparticular, in the slide-type electronic device, the slide body mayinclude a plurality of data lines for transmitting a large amount ofdata. As the communication frequency band increases, the sub-PCB of theslide body may be configured as a high frequency system. In such asystem, since the clock speed increases, it is necessary to secure afast return current path. Thus, additional ground connections may berequired for a stable circuitry design.

For a stable ground connection, various methods may be considered inaddition to the electrical connection using the DC scheme or the ACmanner between the connector structure and the guide structure describedherein. By securing additional paths for the sub-PCB besides the pathincluding the electrical connection described herein, the electronicdevice 101 may secure a sufficient return current path, and thusguarantee the EMI performance.

FIG. 13 illustrates a ground path based on connection between slidestructures including an FPCB, according to an embodiment.

Referring to the illustration 1300 in FIG. 13, an electronic device 101may include a first return current path 1380, based on electricalconnection between a guide structure of a main body and a connectorstructure of a slide body. The first return current path 1380 mayinclude connection of a sub-PCB 1365, a connector structure 1330, aguide structure 1320, and a main PCB 1315 of the slide body. The firstreturn current path 1380 may be formed through the ground connected tothe guide structure.

The electronic device may further include a second return current path1390 in addition to the first return current path 1380. The secondreturn current path may include connection of the sub-PCB 1365, the FPCB1355, and the main PCB 1315. By securing the additional return currentpath, the stable ground connection may be provided.

The electronic device may additionally dispose a conductive structurebetween the slide body and the main body, to build an additional returncurrent path. For example, the conductive structure may include aconnect (C)-clip disposed between the slide body and the main body andphysically contacting the slide body and the main body. The conductivestructure may form a contact to transfer the force in a directionsubstantially perpendicular to (i.e., by 90 degrees) the movement axisof the slide body.

The electronic device may include both the return current path includingthe FPCB and the return current path including the C-clip, alternativelyor in addition to the electrical connection between the slidestructures.

The FPCB of the above-described embodiments may be replaced with acoaxial cable.

FIG. 14A illustrates a connection between slide structures including DCinsulation, according to an embodiment. If an excessive electric currentflows in an electronic device 101 and ground connection is not stablyformed, the excessive current causes an electric shock to the humanbody. The main body may include a metal member. Since the metal materialconducts the electric current and the user may directly contact the mainbody, there is a pervasive risk of electric shock.

Accordingly, an electronic device herein may include a main body and aslide body. The main body may include a main PCB 1415, a guide structure1420, a guide rail 1440, and a driving device 1445. The slide body isconnected to the connector structure 1430 and may include a sub-PCB1465. The main PCB 1415, the guide structure 1420, the connectorstructure 1430, the guide rail 1440, the driving device 1445, and thesub-PCB 1465 exemplify the main PCB 215, the guide structure 220, theconnector structure 230, the guide rail 240, the driving device 245, andthe sub-PCB 265 of FIG. 2A respectively, and accordingly thearrangements, the functions, and the shapes described in the disclosuremay be applied in the same or similar manner.

Referring to the illustration 1400 a in FIG. 14A, to solve theaforementioned electric shock issue, a DC insulation structure 1470 maybe included. The DC insulation structure 1470 may be coated with amaterial (e.g., rubber or synthetic resin) having excellent insulationperformance, on a fixing unit which interconnects the guide structure1420 and the main PCB 1415.

A signal delivered through the guide structure 1420 and the connectorstructure 1430 may be connected to the main PCB 1415 through the DCinsulation structure 1470. A DC component of the signal may be blockedby the DC insulation structure 1470. In addition, the risk of theelectric shock may be decreased, by building the return current path tothe main PCB 1415 forcedly through the DC insulation structure 1470.

FIG. 14B illustrates the return current path based on the connectionbetween the slide structures including the DC insulation, according toan embodiment.

Referring to the illustration 1400 b in FIG. 14B, a first return currentpath 1480 a including the electrical connection between the firstconnector structure and the first guide structure and the firstinsulating structure 1470 a may be formed. For the stable groundconnection, a path using an FPCB may be additionally configured. Theelectronic device 101 may further include a second return current path1410 a. The second return current path 1410 a may include the connectionof the sub-PCB, the FPCB, and the main PCB, as described in reference toFIG. 13. The electronic device may have a symmetrical structure. A thirdreturn current path 1480 b and a fourth return current path 1410 b maybe configured substantially the same as the first return current path1480 a and the second return current path 1410 a.

FIG. 15 illustrates a ground path based on connection between slidestructures including digital circuitry and analog circuitry, accordingto an embodiment. If the digital circuitry and the analog circuitry areincluded, it may be required to separate the ground for the digitalcircuitry and analog circuitry. The digital circuitry is a first groundpath and analog circuitry is a second ground path that is different fromthe ground path. If the ground is not separated, a rapidly changingsignal of the digital circuitry may affect the analog circuitry. If theground is not separated, common impedance may be formed through thecommon ground. The common impedance may deliver noise componentsgenerating in the digital circuitry to the analog circuitry. These noisecomponents may affect offset values of the analog circuitry which isrelatively sensitive and thus lower the performance and stability of theanalog circuitry. Hence, FIG. 15 provides a path arrangement forseparating the ground for the digital circuitry and the ground for theanalog circuitry.

Referring to the illustration 1500 in FIG. 15, the slide body mayinclude a first ground path 1561 and a second ground path 1562 based ona reference line 1560. A sub-PCB of the slide body may include adigital-to-analog converter (DAC) or an analog-to-digital converter(ADC). Both the analog circuitry and the digital circuitry may beconfigured in the sub-PCB. To ensure a stable design of the circuitry,the electronic device 101 may include the first ground path 1561 for thedigital circuitry and the second ground path 1562 for the analogcircuitry.

The electronic device may have a dual slide structure. The electronicdevice may include a first guide structure and a first connectorstructure. In addition, the electronic device may include a second guidestructure and a second connector structure. The first guide structureand the second guide structure each relate to the guide structure 520 or630.

The electrical connection between the first guide structure and thefirst connector structure may provide a first return current path 1580a. The first return current path 1580 a may be connected to the firstground path 1561 for the digital circuitry and provide a digital groundconnection (DGND). The electrical connection between the second guidestructure and the second connector structure may provide a second returncurrent path 1580 b. The second return current path 1580 b may beconnected to the second ground path 1562 for the analog circuitry andprovide an analog ground connection (AGND).

To ensure a stable ground connection, a path using an FPCB may beadditionally configured. The electronic device may further include athird return current path 1510 a. The third return current path 1510 amay include connection of the sub-PCB, the FPCB, and the main PCB, asdescribed in reference to FIG. 13. The sub-PCB may include the firstground path 1561, and the third return current path 1510 a may providedigital ground connection. The electronic device may further include afourth return current path 1510 b. The fourth return current path 1510 bmay include connection of the sub-PCB, the FPCB, and the main PCB, asdescribed in FIG. 13. The sub-PCB may include the second ground path1562, and the fourth return current path 1510 b may provide analogground connection.

As described above, an electronic device of a slide type may include amain body, a guide rail coupled with the main body and allowingrotational movement, a driving device coupled with the main body andcontrolling the rotational movement of the guide rail; a guide structurecoupled with the main body, a slide body, and a connector structurecoupled with the slide body. The connector structure may be coupled withthe guide rail to linearly move according to the rotational movement,the slide body may be flexibly disposed in a designated area accordingto the linear movement of the connector structure, and one surface ofthe connector structure and one surface of the guide structure may beconfigured to form electrical connection.

The electronic device may further include a fixing body for coupling theguide rail and the connector structure, wherein the fixing body may becoupled with the guide rail to linearly move according to the rotationalmovement and coupled with the connector structure such that theconnector structure linearly moves according to the linear movement ofthe fixing body.

If the connector structure is positioned at an end of the linearmovement, the slide body may be disposed at a first position on thedesignated area. If the connector structure is positioned at the otherend of the linear movement, the slide body may be disposed at a secondposition on the designated area. If the connector structure ispositioned between the end and the other end of the linear movement, theslide body may be disposed between the first position and the secondposition on the designated area.

If the slide body is disposed at the first position, the slide body mayoverlap the main body in the least area, when viewed from above onesurface of the electronic device. If the slide body is disposed at thesecond position, the slide body may overlap the main body in the largestarea, when viewed from above the one surface of the electronic device.

A plurality of guide surfaces of the guide structure may include a firstguide surface, a second guide surface, and a third guide surface, and aplurality of bonding surfaces of the connector structure may include afirst bonding surface forming first electrical connection with the firstguide surface if the slide body is disposed at the first position, asecond bonding surface forming second electrical connection with thesecond guide surface if the slide body is disposed at the secondposition, and a third bonding surface of the guide structure formingthird electrical connection with the third guide surface if the slidebody is disposed between the first position and the second position.

The first electrical connection may be DC contact or AC coupling, thesecond electrical connection may be DC contact or AC coupling, and thethird electrical connection may be AC coupling.

At least one of the first bonding surface, the second bonding surface,the third bonding surface, the first guide surface, the second guidesurface, or the third guide surface may be anodizing coating processed.

The electronic device may include a contact member which contacts atleast one of the first bonding surface, the second bonding surface, thethird bonding surface, the first guide surface, the second guidesurface, or the third guide surface, wherein the contact member mayprovide DC contact.

The contact member may include a contact boss and a gasket conductivetape.

The connector structure may be disposed such that the first bondingsurface forms a first separation distance with the first guide surfaceif the slide body is disposed at the first position, such that thesecond bonding surface forms a second separation distance with thesecond guide surface if the slide body is disposed at the secondposition, and such that the third bonding surface forms a thirdseparation distance with the third guide surface if the slide body isdisposed between the first position and the second position.

The first separation distance may be determined based on permittivitybetween the first bonding surface and the first guide surface, thesecond separation distance may be determined based on permittivitybetween the second bonding surface and the second guide surface, and thethird separation distance may be determined based on permittivitybetween the third bonding surface and the third guide surface.

The electronic device may further include a first insulator disposedbetween the first bonding surface and the first guide surface; a secondinsulator disposed between the second bonding surface and the secondguide surface; and a third insulator disposed between the third bondingsurface and the third guide surface.

At least one of the first insulator, the second insulator, or the thirdinsulator may include PI film.

At least one of the first separation distance, the second separationdistance, or the third separation distance may be based on an operatingfrequency of a signal transmitted from circuitry of the slide structureto circuitry of the main structure.

The main body may include a first PCB, and the slide body may include asecond PCB and an FPCB or a coaxial cable connected to the first PCB andthe second PCB.

The main body may include a first PCB, the slide body may include asecond PCB, the guide structure may be connected to the first PCB whichprovides ground, and the connector structure may be connected to thesecond PCB.

The electronic device may further include an additional connectorstructure and an additional guide structure, wherein the second PCB mayinclude analog circuitry and digital circuitry, electrical connectionbetween the first PCB and the second PCB according to coupling of theconnector structure and the guide structure may provide groundconnection for the digital circuitry, and electrical connection betweenthe first PCB and the second PCB according to the additional connectorstructure and the additional guide structure may provide groundconnection for the analog circuitry.

The electronic device may include a first FPCB and a second FPCBconnected to the first PCB and the second PCB, wherein the first FPCBmay provide ground connection for the digital circuitry, and the secondFPCB may provide ground connection for the analog circuitry.

The guide structure may be CNC-processed and disposed on a housing ofthe main body.

As described above, a slide assembly for an electronic device of a slidetype may include a main body, a slide body fluidly disposed in adesignated area, and a connector structure connected to the slide body,wherein the main body may include a guide structure forming a pluralityof guide surfaces including a first guide surface, a second guidesurface, and a third guide surface. The connection structure may form aplurality of bonding surfaces including a first bonding surface, asecond bonding surface, and a third bonding surface. If the slide bodyis disposed at a first position in the designated area, the connectionstructure may be disposed such that the first bonding surface formsfirst electrical connection with the first guide surface. If the slidebody is disposed at a second position in the designated area, theconnection structure may be disposed such that the second bondingsurface forms second electrical connection with the second guidesurface. If the slide body is disposed at a third position in thedesignated area, the connection structure may be disposed such that thethird bonding surface forms electrical connection with the third guidesurface.

The disclosure may include a structure in which DC or AC electricalconnection is formed according to each slide operation throughstructures configured for the slide operation, that is, shape andarrangement between slide structures, rather than connecting a PCB of aslide body and a PCB of a main body by using only a flexible structuresuch as an FPCB/coaxial cable and a physical contact structure such as aC-clip in a slide-type electronic device. At least one of the flexiblestructure or the physical contact structure may be designed as anadditional path.

By changing shape and arrangement of structures for the existing slideoperation, improvement of hardware performance may be achieved withoutan additional structure for circuitry connection. Additional structureinsertion is not required and design cost of the structure may bereduced. In addition, the electronic device 101 may avoid forming acontact using a contact member, including various recovery current pathsfor ground connection, or using a single physical contact structure, andthus minimize performance degradation problem due to characteristicschange such as corrosion or abrasion.

The methods according to the embodiments described in the claims or thespecification of the disclosure may be implemented in software,hardware, or a combination of hardware and software.

As for the software, a computer-readable storage medium storing one ormore programs (software modules) may be provided. One or more programsstored in the computer-readable storage medium may be configured forexecution by one or more processors of an electronic device. One or moreprograms may include instructions for controlling the electronic deviceto execute the methods of the disclosure.

Such a program (software module, software) may be stored to a randomaccess memory, a non-volatile memory including a flash memory, a readonly memory (ROM), an electrically erasable programmable ROM (EEPROM), amagnetic disc storage device, a compact disc (CD)-ROM, digital versatilediscs (DVDs) or other optical storage devices, and a magnetic cassette.Alternatively, the program may be stored to a memory combining part orall of those recording media. A plurality of memories may be included.

In addition, the program may be stored in an attachable storage deviceaccessible via a communication network such as Internet, Intranet, localarea network (LAN), wide LAN (WLAN), or storage area network (SAN), or acommunication network by combining these networks. Such a storage devicemay access a device which executes an embodiment of the disclosurethrough an external port. A separate storage device on the communicationnetwork may access the device which executes an embodiment of thedisclosure.

The elements included in the disclosure are expressed in a singular orplural form. However, the singular or plural expression is appropriatelyselected for the convenience of explanation, the disclosure is notlimited to a single element or a plurality of elements, the elementsexpressed in the plural form may be configured as a single element, andthe elements expressed in the singular form may be configured as aplurality of elements.

While the present disclosure has been described with reference tovarious embodiments, various changes may be made without departing fromthe spirit and the scope of the present disclosure, which is defined,not by the detailed description and embodiments, but by the appendedclaims and their equivalents.

What is claimed is:
 1. An electronic device of a slide type, theelectronic device comprising: a main body; a guide rail coupled with themain body and configured to enable rotational movement; a driving devicecoupled with the main body and configured to control the rotationalmovement of the guide rail; a guide structure coupled with the mainbody; a slide body; and a connector structure coupled with the slidebody, wherein the connector structure is coupled with the guide rail tolinearly move according to the rotational movement, wherein the slidebody is flexibly disposed in a designated area according to the linearmovement of the connector structure, and wherein one surface of theconnector structure and one surface of the guide structure areconfigured to form an electrical connection.
 2. The electronic device ofclaim 1, further comprising: a fixing body configured to couple theguide rail and the connector structure, wherein the fixing body iscoupled with the guide rail to linearly move according to the rotationalmovement, and is coupled with the connector structure such that theconnector structure linearly moves according to the linear movement ofthe fixing body.
 3. The electronic device of claim 2, wherein, if theconnector structure is positioned at a first end of the linear movement,the slide body is disposed at a first position on the designated area,wherein, if the connector structure is positioned at a second end of thelinear movement, the slide body is disposed at a second position on thedesignated area, and wherein, if the connector structure is positionedbetween the first end and the second end of the linear movement, theslide body is disposed between the first position and the secondposition on the designated area.
 4. The electronic device of claim 3,wherein, if the slide body is disposed at the first position, the slidebody protrude from the housing of the main body, when viewed from aboveone surface of the electronic device, and wherein, if the slide body isdisposed at the second position, the slide body is received in thehousing of the main body, when viewed from above the one surface of theelectronic device.
 5. The electronic device of claim 3, wherein aplurality of guide surfaces of the guide structure comprises a firstguide surface, a second guide surface, and a third guide surface, andwherein a plurality of bonding surfaces of the connector structurecomprises, a first bonding surface forming a first electrical connectionwith the first guide surface, if the slide body is disposed at the firstposition; a second bonding surface forming a second electricalconnection with the second guide surface, if the slide body is disposedat the second position, and a third bonding surface forming a thirdelectrical connection with the third guide surface, if the slide body isdisposed between the first position and the second position.
 6. Theelectronic device of claim 5, wherein the first electrical connection isa direct current (DC) contact or an alternating current (AC) coupling,wherein the second electrical connection is the DC contact or the ACcoupling, and wherein the third electrical connection is the ACcoupling.
 7. The electronic device of claim 6, comprising: a contactmember which contacts at least one of the first bonding surface, thesecond bonding surface, the third bonding surface, the first guidesurface, the second guide surface, and the third guide surface, whereinthe contact member provides the DC contact.
 8. The electronic device ofclaim 5, wherein the connector structure is disposed: such that thefirst bonding surface forms a first separation distance with the firstguide surface, if the slide body is disposed at the first position, suchthat the second bonding surface forms a second separation distance withthe second guide surface, if the slide body is disposed at the secondposition, and such that the third bonding surface forms a thirdseparation distance with the third guide surface if the slide body isdisposed between the first position and the second position.
 9. Theelectronic device of claim 8, wherein the first separation distance isdetermined based on permittivity between the first bonding surface andthe first guide surface, wherein the second separation distance isdetermined based on permittivity between the second bonding surface andthe second guide surface, and wherein the third separation distance isdetermined based on permittivity between the third bonding surface andthe third guide surface.
 10. The electronic device of claim 9, furthercomprising: a first insulator disposed between the first bonding surfaceand the first guide surface; a second insulator disposed between thesecond bonding surface and the second guide surface; and a thirdinsulator disposed between the third bonding surface and the third guidesurface.
 11. The electronic device of claim 8, wherein at least one ofthe first separation distance, the second separation distance, and thethird separation distance is based on an operating frequency of a signaltransmitted from circuitry of the slide structure to circuitry of themain structure.
 12. The electronic device of claim 1, wherein the mainbody comprises a first printed circuit board (PCB), wherein the slidebody comprises a second PCB, and wherein the electronic device furthercomprises a flexible PCB (FPCB) or a coaxial cable connected to thefirst PCB and the second PCB.
 13. The electronic device of claim 1,wherein the main body comprises a first printed circuit board (PCB),wherein the slide body comprises a second PCB, wherein the guidestructure is connected to the first PCB which provides ground, andwherein the connector structure is connected to the second PCB.
 14. Theelectronic device of claim 13, further comprising: an additionalconnector structure and an additional guide structure, wherein thesecond PCB comprises analog circuitry and digital circuitry, whereinelectrical connection between the first PCB and the second PCB accordingto coupling of the connector structure and the guide structure providesa ground connection for the digital circuitry, and wherein electricalconnection between the first PCB and the second PCB according to theadditional connector structure and the additional guide structureprovides a ground connection for the analog circuitry.
 15. Theelectronic device of claim 14, comprising: a first FPCB and a secondFPCB connected to the first PCB and the second PCB, wherein the firstFPCB provides the ground connection for the digital circuitry, and thesecond FPCB provides the ground connection for the analog circuitry. 16.The electronic device of claim 6, wherein at least one of the firstbonding surface, the second bonding surface, the third bonding surface,the first guide surface, the second guide surface, and the third guidesurface is subjected to an anodizing coating process.
 17. The electronicdevice of claim 7, wherein the contact member includes a contact boss.18. The electronic device of claim 7, wherein the contact memberincludes a gasket conductive tape.
 19. The electronic device of claim10, wherein at least one of the first insulator, the second insulator,or the third insulator includes a polyimide (PI) film.
 20. Theelectronic device of claim 1, wherein the guide structure is disposed ona housing of the main body by computerized numerical control processing.